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Soft plate material for rainbow was founded the first product, since 1997 breeding, fast growth, and after market customers continued support, and quenching chains, and from the product/technology/equipment complete research and development to the after-sale technical service ability to continue to improve, has now become the worlds top three and the world a...

  • Pigment ink is made of particles dispersion, its minimum size (particle size) than the Dye ink (Dye base ink) of the molecule diameter is much bigger, to nanometers to microns, so really nanoscale is transparent liquid, micron level exists in the form of opaque liquid at ordinary times. Used in the manufacture of paint, ink pigment particle size can be divided into na...

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  • Ink (ink, printing ink) is an important material used for printing, it will by printing design, performance on the substrates. Ink and auxiliary components, including of the main ingredients in them evenly mixed and after repeated rolling and become a jelly-like fluid viscosity. By connecting material (resin), pigments, fillers, additives and solvents, etc. Used in bo...

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  • Soft Copper foil substrate (FCCL abbreviations: Flexible Copper Clad Laminate), also known as: Flexible Copper Clad, Flexible Copper Clad, Flexible Copper Clad, FCCL is Flexible Printed Circuit board (Flexible Printed Circuit board/FPC) processing base material. FCCL except possesses the advantages of thin, light and flexible, with polyimide basilemma FCCL, also has e...

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  • Japans electronic encapsulation and circuit Association (Japan Electronics Packaging Circuits Association, JPCA), founded in 1962, is a voluntary organization of printed circuit board manufacturers. Industry association is responsible for the Japanese electronic packaging and circuit workshops, seminars, JPCA show, set up enterprise standard and improve the statistics...

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  • PI tape, the full name is polyimide tape, one of the most important feature is high temperature resistant. Mainly used in SMT industry, in the wave soldering and reflow soldering to finger protection money.Technology Data:Base material Baching Substrates (thickness) : 0.0250 mm + / - 5% toleranceAdhesive Adhesive (thickness) : 0.035 mm + / - 5% toleranceThe Total Thic...

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